Environmental problems such as global warming have become a significant universal topic. It is absolutely critical for nations, individuals, corporations, such as Seiko Epson, and all other types of groups and organizations to strive to find a solution to these problems.

We have been working on the plan to make our products Lead-Free since June 1999, thereby eliminating environmentally harmful processes and materials by the end of March 2002.

The Products Affected By This Transition Are:

• All Quartz Devices (QD)
• All Semiconductor Devices (IC), except die form
• All Modules

LEAD (Pb)-FREE SCHEDULE

IC/QD Products

1. Our lead-free products can be used with the conventional Sn-Pb Solder Paste as well as lead-free Solder Paste.
2. Effective January 1, 2002, we will accept purchase orders for lead-free parts.
3. All lead-free products will receive new part numbers. New part numbers will be available from November 1, 2001.
4. Samples are available from November 1, 2001.
5. Reliability data available from September 15, 2001.

Modules

1. EPSON modules using lead-free solder have passed reliability testing same as our current products. Guaranteed conditions as shown in product specifications remain unchanged.
2. Lead-free products will start shipping between October 2001 and March 2002.
3. The Module part numbers will not change.

Additional Information

EPSON offers the following documents for customer assistance with approval of lead-free products. For further questions, please contact your local EPSON sales representative

• Working for Pb Free Products of IC (Package) and Quartz Devices defines test conditions and criteria for all products and explains which materials will be used instead of lead.
• The Road to Lead-Free Soldering (for PCB Mounting)