Assembly Overview
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Overview

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Assembly & Test Services

Epson Electronics America (EEA) provides assembly and test services through its parent company, Seiko Epson Corporation.

Packaging, assembly, and test take place in the Singapore Epson Facility with 6.5M pcs monthly capacity.  Utilizing Seiko Epson's design and manufacturing expertise, we have been a long-term assembly provider and offer an array of package types.

Our assembly services offer excellent quality, at competitive pricing and short assembly cycle times.

 

Package offerings include the following:

LOWER THERMAL RESISTANCE PACKAGES

This package type offers a low cost solution for high electrical/thermal performance requirements. Meeting highest JEDEC Level 1 Moisture Sensitivity Level means No Baking Required!

 

EXPOSED DIE PAD QFP (JEDEC Level 2) – HQFP 4

STANDARD QFP/LQFP/TQFP (JEDEC Level 2,3)

PFBGA  

STACKED CSP

WCSP

FLIP CHIP BGA (FCBGA)

MODULE ASSEMBLY

SEP PACKAGE LINEUP

 

Assembly Overview